Material Analytics
X-Ray Analytics

Main activity

The field of competence “X-Ray Analysis” deals with the analysis and characterization of components and component conditions by means of X-rayographic methods. This is achieved using powerful and modern analytical methods in combination with many years of experience in the field of X-ray analysis.

The main focus of the competence field is the fundamental characterization of crystalline layers of all kinds (especially with the special field of thin film analysis), the detection and evaluation of residual stresses of various materials, retained austenite determinations, X-ray transmission tests and computed tomography.

With the available equipment, there are practically no limits to the component sizes, starting with a few 100 µm upwards. By means of a mobile X-ray diffractometer for residual stress analysis, non-destructive measurements can be performed directly on the component without destroying it.

Computed tomography analysis allows three-dimensional visualization of sub-micrometer level features up to non-destructive analysis of real components with 50 cm edge length and 10 kg weight.

The fields of activity include in detail:

By means of modern x-ray diffractometry, qualitative analyses of crystalline phases of all kinds in different geometries like Bragg-Brentano, grazing incidence, and many more are possible.

  • Measurements of residual stresses on various materials such as Fe-ferrite, Fe-austenite, Al, Ni, Cu etc. with the sin²Psi method
  • Psi and Omega geometry
  • Wide range of aperture sizes starting from 0.6mm diameter focal spot
  • Also applicable for textured and coarse-grained samples
  • Measurement of components of any size (mobile operation possible)
  • Measurement and evaluation according to DIN EN 15309:2008 (2009)
  • Reliable determination of the retained austenite content with Cr- Kα radiation
  • Measurement and evaluation according to ASTM E 975-03 (13) with the 4 peak fit method

An electropolishing station specially designed to meet the needs of industry and research has been set up to produce a depth profile for retained austenite determinations and, in particular, for residual stress measurements. Due to the purely chemical material removal, residual stress states remain almost unchanged in depth. The depth removal is possible to an accuracy of 10µm.

3D computed tomography on components up to 10kg permissible total weight for visualization of pores, imperfections, cracks, cold solder joints, checking of dimensions and comparison with nominal values.

  • Microfocus and nanofocus operation for high resolution measurements up to max. 240kV possible
  • 1024x1024 pixel temperature stabilized semiconductor detector
  • detector extension to 2048x1024 pixels switchable
  • use of professional evaluation software (VGStudioMax)
  • X-ray radiography for visualization of pores, imperfections, cold solder joints, verification of dimensions and comparison with nominal values
  • Digital radiographs and evaluations with high-quality post-processing and a wide range of calculation algorithms
  • Analog (conventional) radiographs with film exposure for components > 50 cm edge length and > 10 kg weight